Check with seller Tuyển dụng Hà Nội Tập Đoàn Công Nghệ Apple - Apple Inc. cần tuyển

[Tuyển dụng Hà Nội] Tập Đoàn Công Nghệ Apple - Apple Inc. cần tuyển

Thu nhập:
Thỏa thuận
Loại hình:
Toàn thời gian





Chức vụ:
Nhân viên
kỹ thuật
điện tử
Mô tả công việc
- Definition and trade-off studies of RGB camera optics, sensors, actuator, and packaging.
- Interaction with optical, electrical, process, controls systems, sensing, test, and mechanical teams on integration of camera hardware into products.
- Leadership of offshore manufacturing partners on camera design evaluation, product prototype builds, and qualification.
- Leadership of failure analysis and corrective action implementation at manufacturing sites as well as remotely, including assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures.
- Evaluation and debugging of camera HW at module and product levels for Camera Design and Integration.
- Documentation of camera-specific design, test, and manufacturing requirements.
- International travel may be required to supplier facilities for product development and production bring-up.
Yêu cầu
BSc/MSc/PhD in relevant field (
Electrical Engineer
ing, Mechanical Engineering, Optics, Physics, Materials or equivalent).
Able to communicate and convey ideas clearly and concisely.
Thông tin khác
Ability to lead a multi-functional team of engineers and scientists with unique background and technical expertise through the R&D phase of product development from concept to mass production is a key requirement.
Ability to influence other teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule are key requirements.
Able to communicate and convey ideas clearly and concisely.
The applicant will also be familiar with at least 3 of the skills listed below:
- Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms.
- Electronic circuit and system design including power and signal integrity.
- Understanding of geometric optics and image quality evaluation including test charts, algorithms, and lighting.
- Image/depth sensor design or characterization.
- Compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc.
- Failure analysis techniques such as optical microscopy, X-ray, CT scans or SEM.
- Demonstrated ability in root-cause and corrective-action analysis.
- Proficiency in statistical analysis, data reporting, and visualization.
- Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.
Thông tin chung
Thu nhập: Thỏa thuận
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